Of course, the first thing people usually look at is what’s inside: AI computing power, storage capacity, data transfer rates. Yet when it comes to a rugged embedded computer, the enclosure plays just as central a role. Time, then, to take a closer look at it.
The housing of a Syslogic embedded system protects the electronics from external factors such as moisture and dust, as well as from mechanical stress caused by shock, vibration, or pressure. It reliably dissipates heat, ensures electromagnetic compatibility, and is – quite literally – a heavyweight component of Syslogic’s brand identity.
The housings of Syslogic rugged computers are developed in-house by the company’s design and engineering team, and then manufactured by trusted partners. The cooling fins are engineered to optimally dissipate the heat generated by powerful NVIDIA system-on-modules or Intel processors. Thanks to the passive cooling concept, Syslogic can eliminate the need for a failure-prone fan – enabling long-term, maintenance-free operation.
Rugged computers are primarily used in agricultural machinery, construction equipment, and autonomous vehicles. Accordingly, the enclosures must meet high standards of robustness and durability. Syslogic rugged computers achieve IP67 and IP69 protection ratings, making them resistant to water, dust, and extreme temperatures.
The housings are milled from solid aluminum blocks and then anodized. This process creates a hard, thick oxide layer that strengthens the aluminum and provides excellent corrosion resistance. In addition, all grounding and contact points are passivated to ensure electromagnetic compatibility.
Syslogic also makes no compromises when it comes to connectivity, using screwable M12 connectors. These resist vibrations and prevent dust or moisture from entering the device. Pressure and humidity are equalized via a Gore vent integrated into the side of the housing.
A key requirement in enclosure design, aside from thermal management, is compactness, since rugged computers are often installed in tight spaces inside autonomous machines or vehicles. While functional considerations define the basic shape, Syslogic places great importance on a monolithic, “cast-from-one-piece” look. This design approach also communicates Syslogic’s core values: longevity, ingenuity, and passion. The attention to detail pays off – as shown by the prestigious Red Dot Design Award won by the AI Rugged Computer A3N.
While Syslogic handles development and electronics production entirely in-house, the enclosure manufacturing is carried out by specialized partners. One of them is ITS AG, based in Rebstein, Switzerland – a company Syslogic has successfully worked with for many years. Now in its second generation under Kevin and David Wasler, ITS operates a state-of-the-art machine park and brings deep expertise in aluminum processing.
During our visit to Rebstein, we witnessed step by step how a Syslogic enclosure takes shape. The ITS team starts by importing Syslogic’s CAD model into their machining program for the CNC milling machine. Milling paths, spindle speeds, feed rates, and tool changes are defined and then transmitted to the machine. The solid aluminum block, serving as the raw material, is fixed in place. Diamond-coated milling tools rotate at high speeds, precisely carving out the programmed contours. This is how cooling fins, edges, and drill holes are created – with tolerances down to hundredths of a millimeter and surfaces requiring little to no finishing.
The enclosure is far more than just a shell – it is shield, heat sink, and brand ambassador all in one. With its rugged construction and thoughtful design, it embodies Syslogic’s values. And at first glance, it makes one thing clear: Syslogic rugged computers are the number-one choice wherever the demands are toughest.
