The Techship Kigen SGP.22+ Tri-cut eUICC enables flexible eSIM connectivity with Remote SIM Provisioning (RSP). Designed for consumer eSIM systems, it fits 2FF, 3FF, and 4FF SIM slots and includes GSMA eUICC certificates for live deployments. Ideal for industrial IoT and perfectly suited for use with Syslogic embedded systems requiring reliable and scalable cellular connectivity.
Offer
Details
Article
CPN/ESIM-KIGENSGP22
Tech Facts
eUICC standard SGP.22 (Consumer)
Write endurance >2M cycles
LPA type LPAd (in device)
Operating Temperature Range –40–105 °C
Maximum number of profiles 8
Driver Support Windows 11 , Windows 10, Linux, Windows, Android
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